Samsung has started working on the 10nm FinFET Process Technology, back in October last year. Recently, Samsung had announced the Exynos 9 Series 8895 SoC which is again based on the 10nm FinFET process.
Samsung claims to shipped more than 70,000 silicon wafers of its first-generation 10nm LPE (Low Power Early) to date. The company began the industry’s first mass production of 10LPE last October.
Jongshik Yoon, Executive Vice President and Head of Foundry Business at Samsung Electronics said,
“Samsung’s 10nm LPE is a game changer in the foundry industry. Following the 10LPE version, the 10nm LPP and LPU will enter mass production by the end of the year and next year, respectively. We will continue to offer the most competitive process technology in the industry.”
Also Read: Samsung Exynos 9 Series Chipset teased
Samsung Electronics has also announced the addition of the 8nm and the 6nm process technologies to its current process roadmap. Samsung’s 8nm and 6nm offerings will provide greater scalability, performance and power advantages when compared to existing process nodes. The 8nm and the 6nm will inherit all innovations from the latest 10nm and the 7nm technologies with design infrastructure enhancements to meet various customer needs and provide further cost competitiveness.
Samsung’s foundry technology roadmap and technical details, including the newest 8nm and the 6nm, will first be open to its customers and partners at the upcoming U.S Samsung Foundry Forum scheduled for May 24, 2017.